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Refined variational solutions of the interfacial thermal stresses in a laminated beam

Authors :
Yin, W.-L.
Source :
Journal of Electronic Packaging. June, 1992, Vol. 114 Issue 2, p193, 6 p.
Publication Year :
1992

Abstract

A method for determining the interlaminar thermal stresses in laminated multi-layered beams under varying temperature levels is discussed. Thermal expansion in every beam layer is calculated using high-order polynomial expansions of the stress functions in conjunction with a computer program. This technique can be very useful in analyzing the thermal expansion behavior of multi-layered beams with the least amount of effort.

Details

ISSN :
10437398
Volume :
114
Issue :
2
Database :
Gale General OneFile
Journal :
Journal of Electronic Packaging
Publication Type :
Academic Journal
Accession number :
edsgcl.13846395