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An approximate thermal contact conductance correlation
- Source :
- Journal of Electronic Packaging. March, 1993, Vol. 115 Issue 1, p131, 4 p.
- Publication Year :
- 1993
-
Abstract
- An approximate thermal contact conductance correlation which does not depend upon the surface asperity slope was developed. Published surface texture data for 65 specimens were used to establish a relationship between the average roughness and the RMS asperity slope, which was then used to develop a new approximate thermal contact conductance correlation. The investigation was conducted for a range of surface roughness typical of contacting surfaces. Comparison to limited test data and to 2080 simulated contact joints, indicates the new approximate thermal contact conductance correlation has an expected RMS error of approximately 23 percent.
- Subjects :
- Thermal analysis -- Research
Thermal stresses -- Research
Electronics
Subjects
Details
- ISSN :
- 10437398
- Volume :
- 115
- Issue :
- 1
- Database :
- Gale General OneFile
- Journal :
- Journal of Electronic Packaging
- Publication Type :
- Academic Journal
- Accession number :
- edsgcl.13799509