A microfabricated floating-element shear stress sensor using wafer-bonding technology

The design of a microfabricated floating-element sensor is presented. Fabricated via wafer-bonding technology, the sensor measures liquid shear stresses at high levels and at high pressure. An analytical and finite element analysis of the device's operation in a cone and plate viscometer is described alongside test results of its mechanical strength in high pressure surroundings. The sensor was developed for application in the industrial extrusion process.