Effect of 0.5 wt% Cu addition in Sn-3.5%Ag solder on the dissolution rate of Cu metallization

Authors :: Alam, M.O.
Chan, Y.C.
Tu, K.N.
Source :: Journal of Applied Physics. Dec 15, 2003, Vol. 94 Issue 12, 7904-7909
Publication Year :: 2003
Abstract: The role of 0.5 wt % Cu in the base Sn-3.5%Ag solder is highlighted to reduce the dissolution of the Cu bond pad in ball grid array applications. It was found that after 0.5 wt% Cu addition, the rate of dissolution of Cu in the molten Sn-3.5%Ag solder slowed down significantly.

Subjects :: Silver compounds -- Optical properties
Tin compounds -- Optical properties
Copper compounds -- Optical properties
Physics

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