Corrosion‐Resistant Ultrathin Cu Film Deposited on N‐Doped Amorphous Carbon Film Substrate and Its Use for Crumpleable Circuit Board

Abstract Copper (Cu) is widely used as an industrial electrode due to its high electrical conductivity, mechanical properties, and cost‐effectiveness. However, Cu is susceptible to corrosion, which degrades device performance over time. Although various methods (alloying, physical passivation, surface treatment, etc.) are introduced to address the corrosion issue, they can cause decreased conductivity or vertical insulation. Here, using the nitrogen‐doped amorphous carbon (a‐C:N) thin film is proposed as a substrate on which Cu is directly deposited. This simple method significantly inhibits corrosion of ultrathin Cu (