Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology

MLA

Yifan Yao, et al. “Coupling Effect between Electromigration and Joule Heating on the Failure of Ball Grid Array in 3D Integrated Circuit Technology.” Journal of Materials Research and Technology, vol. 28, no. 3573–3582, Jan. 2024, pp. 3573–82. EBSCOhost, https://doi.org/10.1016/j.jmrt.2023.12.187.

APA

Yifan Yao, Yuxuan An, K.N. Tu, & Yingxia Liu. (2024). Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology. Journal of Materials Research and Technology, 28(3573–3582), 3573–3582. https://doi.org/10.1016/j.jmrt.2023.12.187

Chicago

Yifan Yao, Yuxuan An, K.N. Tu, and Yingxia Liu. 2024. “Coupling Effect between Electromigration and Joule Heating on the Failure of Ball Grid Array in 3D Integrated Circuit Technology.” Journal of Materials Research and Technology 28 (3573–3582): 3573–82. doi:10.1016/j.jmrt.2023.12.187.