Robust Packaging of Vertically Aligned Graphite Substrate by Copper Micro-Rib Structuring

MLA

Tatsuhiko Aizawa, et al. “Robust Packaging of Vertically Aligned Graphite Substrate by Copper Micro-Rib Structuring.” C, vol. 8, no. 4, Nov. 2022, p. 70. EBSCOhost, https://doi.org/10.3390/c8040070.

APA

Tatsuhiko Aizawa, Hiroki Naka, Takeshi Nasu, & Yoshiro Nogami. (2022). Robust Packaging of Vertically Aligned Graphite Substrate by Copper Micro-Rib Structuring. C, 8(4), 70. https://doi.org/10.3390/c8040070

Chicago

Tatsuhiko Aizawa, Hiroki Naka, Takeshi Nasu, and Yoshiro Nogami. 2022. “Robust Packaging of Vertically Aligned Graphite Substrate by Copper Micro-Rib Structuring.” C 8 (4): 70. doi:10.3390/c8040070.