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Effects of grading tungsten powders on properties of CuW alloy
- Source :
- Materials Research Express, Vol 7, Iss 2, p 026528 (2020)
- Publication Year :
- 2020
- Publisher :
- IOP Publishing, 2020.
-
Abstract
- Considering the advantages and disadvantages of CuW alloys with different single particle size of tungsten powder, CuW alloys with three kinds of tungsten powders: ultramicron (50 μ m), micron(6–8 μ m), submicron(0.4 μ m) were prepared by the infiltration method. Microstructure of the CuW alloy with different grading ration of tungsten powder were characterized via field-emission scanning electron microscope (SEM). The Vacuum electrical breakdown properties were studied by electrical breakdown test. The results shows that the grading tungsten powders can form a variety of W-W sintered necks, strengthen the tungsten skeleton. SEM results show that a suitable ratio of grading tungsten powders can make the infiltrated copper phase more dispersed and uniform. Compared with the tradition CuW alloy, the conductivity is greater than 53.5%IACS, with the lowest hardness of 203HB, the lowest CuW/CrCu bonding strength of 417 MPa and the highest of 495 MPa, the hardness and electrical conductivity increased by 20%–30%, the bonding strength of new CuW/CrCu monolithic materials increased by 20%, vacuum electrical breakdown properties performed good.
Details
- Language :
- English
- ISSN :
- 20531591
- Volume :
- 7
- Issue :
- 2
- Database :
- Directory of Open Access Journals
- Journal :
- Materials Research Express
- Publication Type :
- Academic Journal
- Accession number :
- edsdoj.98dc071dc3ff44f0bfd50326068f52e0
- Document Type :
- article
- Full Text :
- https://doi.org/10.1088/2053-1591/ab6e31