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On-Wafer Measurements for Extraction of Effective Dielectric Constant in IC Transmission Lines on Multilayer Substrates
- Source :
- Telfor Journal, Vol 4, Iss 2, Pp 138-143 (2012)
- Publication Year :
- 2012
- Publisher :
- Telecommunications Society, Academic Mind, 2012.
-
Abstract
- Methodology for extracting an effective dielectric constant of microstrip transmission lines on multilayer substrates, from measured or simulated S-parameters data, using on-chip test structures, has been demonstrated. The methodology consists of: 1) building on-chip interconnect structures usually implemented in calibration and de-embedding procedures in microwave on-wafer test and measurements – transmission lines, stubs and pad launchers; 2) extracting the effective dielectric constant from the characteristic impedance and propagation constant of these structures, fully described by the measured or EM-simulated S-parameters. The demonstrated methodology is applicable for evaluation of dielectric and semiconductor multilayer substrates, both with lossy and lossless characteristics over a broad frequency band. Another advantage is implementation of very short transmission line structures with physical dimensions much smaller than a quarter wavelength of the highest investigated band frequency, thus preserving a valuable chip area in the test structures and being compatible with some of the calibration TRL elements.
Details
- Language :
- English
- ISSN :
- 18213251
- Volume :
- 4
- Issue :
- 2
- Database :
- Directory of Open Access Journals
- Journal :
- Telfor Journal
- Publication Type :
- Academic Journal
- Accession number :
- edsdoj.8cdc7a30a4b05ab2ee01912e3f74f
- Document Type :
- article