Effect of microstructure on the properties of polystyrene microporous foaming material

The performance of Polystyrene microporous foaming (PS-MCF) materials is influenced by their microstructures. Therefore, it is essential for industrializing them to investigate the relationship between their microstructure and material properties. In this study, the relationship between the microstructure, compressive property, and thermal conductivity of the PS-MCF materials was studied systematically. The results show that the ideal foaming pressure of PS-MCF materials, obtaining compression performance, is around 20 MPa. In addition, the increase of temperature causes the decrease of sample density. It effects that the compression modulus and strength increase with the decrease of foaming temperature. Because the expansion rate and cell diameter of the PS-MCF materials reduce the thickness of cell wall, they are also negatively correlated with their mechanical properties. Moreover, there is a negative linear correlation between the thermal conductivity and cell rate, whereas the cell diameter is positively correlated with the thermal conductivity.