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Revealing the Intrinsic Electronic Structure of 3D Half‐Heusler Thermoelectric Materials by Angle‐Resolved Photoemission Spectroscopy

Authors :
Chenguang Fu
Mengyu Yao
Xi Chen
Lucky Zaehir Maulana
Xin Li
Jiong Yang
Kazuki Imasato
Fengfeng Zhu
Guowei Li
Gudrun Auffermann
Ulrich Burkhardt
Walter Schnelle
Jianshi Zhou
Tiejun Zhu
Xinbing Zhao
Ming Shi
Martin Dressel
Artem V. Pronin
G. Jeffrey Snyder
Claudia Felser
Source :
Advanced Science, Vol 7, Iss 1, Pp n/a-n/a (2020)
Publication Year :
2020
Publisher :
Wiley, 2020.

Abstract

Abstract Accurate determination of the intrinsic electronic structure of thermoelectric materials is a prerequisite for utilizing an electronic band engineering strategy to improve their thermoelectric performance. Herein, with high‐resolution angle‐resolved photoemission spectroscopy (ARPES), the intrinsic electronic structure of the 3D half‐Heusler thermoelectric material ZrNiSn is revealed. An unexpectedly large intrinsic bandgap is directly observed by ARPES and is further confirmed by electrical and optical measurements and first‐principles calculations. Moreover, a large anisotropic conduction band with an anisotropic factor of 6 is identified by ARPES and attributed to be one of the most important reasons leading to the high thermoelectric performance of ZrNiSn. These successful findings rely on the grown high‐quality single crystals, which have fewer Ni interstitial defects and negligible in‐gap states on the electronic structure. This work demonstrates a realistic paradigm to investigate the electronic structure of 3D solid materials by using ARPES and provides new insights into the intrinsic electronic structure of the half‐Heusler system benefiting further optimization of thermoelectric performance.

Details

Language :
English
ISSN :
21983844
Volume :
7
Issue :
1
Database :
Directory of Open Access Journals
Journal :
Advanced Science
Publication Type :
Academic Journal
Accession number :
edsdoj.825952d22c44ced9eae5a6aa3cb98d7
Document Type :
article
Full Text :
https://doi.org/10.1002/advs.201902409