Cite
Optimization of Steam Microwave Curing Process by Response Surface-Principal Component Analysis
MLA
Wenqian FU, et al. “Optimization of Steam Microwave Curing Process by Response Surface-Principal Component Analysis.” Shipin Gongye Ke-Ji, vol. 43, no. 18, Sept. 2022, pp. 152–61. EBSCOhost, https://doi.org/10.13386/j.issn1002-0306.2021090310.
APA
Wenqian FU, Yujia BAI, Yuming LIU, Zuoshan FENG, Kaisheng WANG, & Tingting HUANG. (2022). Optimization of Steam Microwave Curing Process by Response Surface-Principal Component Analysis. Shipin Gongye Ke-Ji, 43(18), 152–161. https://doi.org/10.13386/j.issn1002-0306.2021090310
Chicago
Wenqian FU, Yujia BAI, Yuming LIU, Zuoshan FENG, Kaisheng WANG, and Tingting HUANG. 2022. “Optimization of Steam Microwave Curing Process by Response Surface-Principal Component Analysis.” Shipin Gongye Ke-Ji 43 (18): 152–61. doi:10.13386/j.issn1002-0306.2021090310.