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Adhesion property between low-thermal-expansion poly(benzoxazole-imide) film and ion-implanted copper

Adhesion property between low-thermal-expansion poly(benzoxazole-imide) film and ion-implanted copper

Authors :
CUI Chao
YUAN Lili
YIN Liang
HUANG Yudong
MENG Linghui
YANG Nianqun
YANG Shiyong
Source :
Cailiao gongcheng, Vol 50, Iss 10, Pp 128-138 (2022)
Publication Year :
2022
Publisher :
Journal of Materials Engineering, 2022.

Abstract

Surface modification of poly(benzoxazole-imide) (PI) film was carried out by means of oxygen plasma treatment. A flexible copper clad laminate (FCCL) was fabricated using Ni-Cr ion implantation and electro-Cu plating process. Controlling the constant pressure, the effects of such treatment conditions as power and time were systematically investigated on the surface roughness, chemical composition and interface adhesion with Cu. It is found that the optical parameters for production of FCCL with excellent adhesion and solder resistance are 50 W/5 min and 100 W/10 min, respectively. Suitable roughness, reactive radical with high content pendent oxygen group, and metal-oxazole complex help to endow exceptional adhesive property to the interface of PI/Cu. And the peel strength of FCCL prepared from PI film with such modified surface rises by 60%.

Details

Language :
Chinese
ISSN :
10014381
Volume :
50
Issue :
10
Database :
Directory of Open Access Journals
Journal :
Cailiao gongcheng
Publication Type :
Academic Journal
Accession number :
edsdoj.70b6817682d242f5abc288d596fcdef0
Document Type :
article
Full Text :
https://doi.org/10.11868/j.issn.1001-4381.2021.001095