3D Electronic Sensors for Bio‐Interfaced Electronics and Soft Robotics

Abstract Multi‐dimensional electronic devices for sensing applications have received immense attention in the fields of bio‐interface electronics and soft robotics to achieve structural manifolds in recent years. The structural diversities of sensors are tuned based on the environments in which they encounter multipurpose and complex form factors of electronics. 3D electronics are one of the emerging sensor platforms characterized by structural adaptability and compatibility on free target surfaces, resulting in unprecedented improvement of spatial resolution. Herein, the recent progress made in the fabrication and usage of 3D electronic sensors that are classified into two groups based on the methodological concepts used for fabrication in bio‐interfaced electronics and soft robotics applications, is reviewed. The latest advances in the design and development of 3D printable and 2D to 3D shape‐deformable electronic sensors are reviewed with a focus on printable materials and deformation mechanisms, respectively. 3D printing techniques enable the facile fabrication of arbitrary and seamless electronics without the use of conventional microfabrication technologies. Deformable electronics cover their self‐tune architectures and functions depending on mechanical deformation based on buckling, origami, and kirigami fabrication strategies. Finally, the printed and deformable 3D sensors show their potential for use in next‐generation sensing platforms.