Bioinspired Ultra-Low Adhesive Energy Interface for Continuous 3D Printing: Reducing Curing Induced Adhesion

MLA

L. Wu, et al. “Bioinspired Ultra-Low Adhesive Energy Interface for Continuous 3D Printing: Reducing Curing Induced Adhesion.” Research, vol. 2018, Jan. 2018. EBSCOhost, https://doi.org/10.1155/2018/4795604.

APA

L. Wu, Z. Dong, H. Du, C. Li, N. X. Fang, & Y. Song. (2018). Bioinspired Ultra-Low Adhesive Energy Interface for Continuous 3D Printing: Reducing Curing Induced Adhesion. Research, 2018. https://doi.org/10.1155/2018/4795604

Chicago

L. Wu, Z. Dong, H. Du, C. Li, N. X. Fang, and Y. Song. 2018. “Bioinspired Ultra-Low Adhesive Energy Interface for Continuous 3D Printing: Reducing Curing Induced Adhesion.” Research 2018 (January). doi:10.1155/2018/4795604.