ELECTRODEPOSITION OF COPPER POWDER FROM MIXTURE SULPHATE –CHLORIDE ACIDIC SOLUTION

This paper studies the preparation of Copper powder from Copper Sulphate aqueous solution(CuSO4.5H2O), sulfuric acid (H2SO4) and copper chloride (CuCl2.2H2O)by using the process of electro-deposition. Process of Powder deposition have been investigated for copper powder, it is a fine layer on cathode electrode by using the value of different from current densities (0.12, 0.14, 0.16, and 0.18) A/cm2 .as it is noticed the weight of the powder rises with there is of current density. Diffractions of X-ray (XRD) revealed high crystallinity and pure copper powder not contain impurity or oxides. Size of the Crystallite has been measured by Scherrer's Formula about (38.44 -43.161) nm. Optical microscopes have revealed the particles of copper have dendritic shapes. The size of Particles analyzer measured the size of a particle which is about (2.4 – 8.7) μm.