Comprehensive analysis of Sn58Bi/Cu solder joints reinforced with Mg particles: Wettability, thermal, mechanics, and microstructural characterization

In this study, the Sn58Bi-xMg (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0) composite solders were synthesized to explore the impact of Mg particles. The study examined the wettability, thermal properties, mechanical properties, microstructure, and growth of interfacial IMC (intermetallic compound) of composite solder. Experimental results showed that adding Mg particles had no significant impact on the melting point of Sn58Bi solder. However, increasing the Mg content increased the undercooling of the solder. Moreover, the incorporation of Mg particles resulted in a consistent rise in the coefficient of thermal expansion (CTE) of the composite solder, ranging from 11.4 × 10−6/°C to 15.6 × 10−6/°C. It was worth noting that including Mg particles enhanced the wetting ability of Sn58Bi alloy on Cu substrates. With a 0.4 % addition of Mg particles, the wetting area could be increased by 60.14 %, and the lowest wetting angle was approximately 10.43°. Adding Mg particles resulted in an amelioration in the brittleness of the Bi-rich phase within the solder matrix, coupled with a decrease in both the thickness of IMC and the grain size at the joint interface. Compared to the joints without mixed Mg particles, the shear strength of Sn58Bi-0.4Mg solder joints and the microhardness of the alloy increased by 30 % and decreased by 10 %, respectively. Also, the presence of dimples within the fracture indicated a rise in the ductility of the solder joints. Overall, adding 0.4 wt% Mg particles in this experiment resulted in a more effective modification of the Sn58Bi solder comprehensive properties.