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Fiber-Optic Temperature Sensor Based on Difference of Thermal Expansion Coefficient Between Fused Silica and Metallic Materials

Authors :
Xuefeng Li
Shuo Lin
Jinxing Liang
Yupeng Zhang
Hiroshi Oigawa
Toshitsugu Ueda
Source :
IEEE Photonics Journal, Vol 4, Iss 1, Pp 155-162 (2012)
Publication Year :
2012
Publisher :
IEEE, 2012.

Abstract

In this paper, we report a novel fiber-optic Fabry-Perot interferometric (FFPI) temperature sensor based on the difference of thermal expansion coefficient between fused silica and metallic materials. The sensor head is made by a single-mode fiber (SMF). A gold film and a nickel film are sputtered and electroplated on the surface of the SMF. Then, a microcavity is micromachined by focused ion beam (FIB) milling. Because the thermal expansion coefficient of nickel is about 20 times of fused silica, the different thermal expansions force the sensor head to bend when the temperature is high or low. Its temperature sensitivity is over 14 pm/°C in a wide range from -79°C to +70°C. And the coefficient of determination R2 is excellent (over 0.995). Moreover, the metallic cylinder can reinforce the cavity spot of the fiber sensor, so that this kind of sensor can work in harsh environments. For the first time to the best of our knowledge, we report this type of FFPI temperature sensor based on difference of thermal expansion coefficient between fused silica and metallic materials.

Details

Language :
English
ISSN :
19430655
Volume :
4
Issue :
1
Database :
Directory of Open Access Journals
Journal :
IEEE Photonics Journal
Publication Type :
Academic Journal
Accession number :
edsdoj.437da1b7203741329200b847a8e6c1f9
Document Type :
article
Full Text :
https://doi.org/10.1109/JPHOT.2011.2181943