Real‐time reliability evaluation method for IGBT module in MMC based on junction temperature and bond wire failure online monitoring

MLA

Zhonghao Dongye, et al. “Real‐time Reliability Evaluation Method for IGBT Module in MMC Based on Junction Temperature and Bond Wire Failure Online Monitoring.” IET Power Electronics, vol. 17, no. 15, Nov. 2024, pp. 2561–71. EBSCOhost, https://doi.org/10.1049/pel2.12806.

APA

Zhonghao Dongye, Wuyu Zhang, Lei Qi, Bowen Gu, Hong Shen, Xiangyu Zhang, & Xiang Cui. (2024). Real‐time reliability evaluation method for IGBT module in MMC based on junction temperature and bond wire failure online monitoring. IET Power Electronics, 17(15), 2561–2571. https://doi.org/10.1049/pel2.12806

Chicago

Zhonghao Dongye, Wuyu Zhang, Lei Qi, Bowen Gu, Hong Shen, Xiangyu Zhang, and Xiang Cui. 2024. “Real‐time Reliability Evaluation Method for IGBT Module in MMC Based on Junction Temperature and Bond Wire Failure Online Monitoring.” IET Power Electronics 17 (15): 2561–71. doi:10.1049/pel2.12806.