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Bridging the gap between atomically thin semiconductors and metal leads

Authors :
Xiangbin Cai
Zefei Wu
Xu Han
Yong Chen
Shuigang Xu
Jiangxiazi Lin
Tianyi Han
Pingge He
Xuemeng Feng
Liheng An
Run Shi
Jingwei Wang
Zhehan Ying
Yuan Cai
Mengyuan Hua
Junwei Liu
Ding Pan
Chun Cheng
Ning Wang
Source :
Nature Communications, Vol 13, Iss 1, Pp 1-9 (2022)
Publication Year :
2022
Publisher :
Nature Portfolio, 2022.

Abstract

Barrier-free metal-semiconductor interfaces are crucial to improve the performance of 2D electronic devices. Here, the authors report a strategy to induce local bonding distortion in 2D transition metal dichalcogenides via soft oxygen plasma treatments, leading to reduced contact resistance and improved transport properties.

Subjects

Subjects :
Science

Details

Language :
English
ISSN :
20411723
Volume :
13
Issue :
1
Database :
Directory of Open Access Journals
Journal :
Nature Communications
Publication Type :
Academic Journal
Accession number :
edsdoj.2d598fbb0c949eb9bcf11ce4a44a979
Document Type :
article
Full Text :
https://doi.org/10.1038/s41467-022-29449-4