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Highly sensitive and robust 3C-SiC/Si pressure sensor with stress amplification structure

Authors :
Braiden Tong
Tuan-Hung Nguyen
Hong-Quan Nguyen
Tuan-Khoa Nguyen
Thanh Nguyen
Toan Dinh
Ngo Vo Ke Thanh
Truong Huu Ly
Nguyen Chi Cuong
Hoang Ba Cuong
Trinh Xuan Thang
Van Thanh Dau
Dzung Viet Dao
Source :
Materials & Design, Vol 224, Iss , Pp 111297- (2022)
Publication Year :
2022
Publisher :
Elsevier, 2022.

Abstract

SiC based pressure sensors show tremendous promise for harsh environment applications thanks to their excellent mechanical, electrical, thermal, and chemical properties. This paper presents the design, fabrication, and characterisation of a highly sensitive and robust 3C-SiC/Si pressure sensor. The sensor utilises a stress amplification structure consisting of four Si pillars built up from the 3C-SiC/Si membrane, supporting a series of released n-type 3C-SiC sensing elements. When pressure is applied to the diaphragm, the pillars act to locally concentrate and amplify strain in the 3C-SiC sensing elements, resulting in over 7 times higher stresses/strains in these sensing elements compared to a traditional structure. Additionally, the front side of the sensor is fully covered by a 3C-SiC thin film, which provides a strong chemical protective capability, allowing the sensor to operate in harsh chemically corrosive environments. The robust device utilises the full Wheatstone bridge to negate the effects of temperature. Experimental results show that the fabricated sensor is highly stable, repeatable, has a high sensitivity of 0.276 mV/V/kPa and a maximum non-linearity of 2.2 % in the 0–100 kPa region. The results indicate that this smart-structure pressure sensor is promising for applications that require highly precise pressure sensing in aggressively corrosive environments.

Details

Language :
English
ISSN :
02641275
Volume :
224
Issue :
111297-
Database :
Directory of Open Access Journals
Journal :
Materials & Design
Publication Type :
Academic Journal
Accession number :
edsdoj.20d7779b644c465d9755533ffa407013
Document Type :
article
Full Text :
https://doi.org/10.1016/j.matdes.2022.111297