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Development of a Novel Low-Silver Cu-P Brazing Filler Metal Bearing Sn

Authors :
Jie Wu
Songbai Xue
Qingcheng Luo
Source :
Crystals, Vol 12, Iss 1, p 66 (2022)
Publication Year :
2022
Publisher :
MDPI AG, 2022.

Abstract

The flame brazing of H62 brass using a novel, low-silver Cu-P brazing filler metal was investigated in this study. The effect of the addition of a trace amount of Sn on the microstructure and properties of Cu-7P-1Ag filler metals was analyzed by means of X-ray diffractometer, scanning electron microscopy and energy dispersive spectrometer. The addition of trace Sn led to a decrease in the solidus and liquidus temperatures of Cu-7P-1Ag filler metals. Meanwhile, the spreading performance of the filler metals on a H62 brass substrate was improved. The microstructure of the low-silver, Cu-P brazing filler metal was mainly composed of α-Ag solid solution, α-Cu solid solution and Cu3P; an increase of Sn content led to the transformation of the microstructure of the joints from a block to a lamellar structure. When the Sn content was 0.5 wt. %, the shear strength of the joint at room temperature reached 348 MPa, and the fracture morphologies changed from a cleavage to a quasi-cleavage structure.

Details

Language :
English
ISSN :
20734352
Volume :
12
Issue :
1
Database :
Directory of Open Access Journals
Journal :
Crystals
Publication Type :
Academic Journal
Accession number :
edsdoj.1acb8dd3ad9c4681884c97accef5f6b3
Document Type :
article
Full Text :
https://doi.org/10.3390/cryst12010066