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Development of a Novel Low-Silver Cu-P Brazing Filler Metal Bearing Sn
- Source :
- Crystals, Vol 12, Iss 1, p 66 (2022)
- Publication Year :
- 2022
- Publisher :
- MDPI AG, 2022.
-
Abstract
- The flame brazing of H62 brass using a novel, low-silver Cu-P brazing filler metal was investigated in this study. The effect of the addition of a trace amount of Sn on the microstructure and properties of Cu-7P-1Ag filler metals was analyzed by means of X-ray diffractometer, scanning electron microscopy and energy dispersive spectrometer. The addition of trace Sn led to a decrease in the solidus and liquidus temperatures of Cu-7P-1Ag filler metals. Meanwhile, the spreading performance of the filler metals on a H62 brass substrate was improved. The microstructure of the low-silver, Cu-P brazing filler metal was mainly composed of α-Ag solid solution, α-Cu solid solution and Cu3P; an increase of Sn content led to the transformation of the microstructure of the joints from a block to a lamellar structure. When the Sn content was 0.5 wt. %, the shear strength of the joint at room temperature reached 348 MPa, and the fracture morphologies changed from a cleavage to a quasi-cleavage structure.
Details
- Language :
- English
- ISSN :
- 20734352
- Volume :
- 12
- Issue :
- 1
- Database :
- Directory of Open Access Journals
- Journal :
- Crystals
- Publication Type :
- Academic Journal
- Accession number :
- edsdoj.1acb8dd3ad9c4681884c97accef5f6b3
- Document Type :
- article
- Full Text :
- https://doi.org/10.3390/cryst12010066