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Comparison of Bonding Performance Between Plywood and Laminated Veneer Lumber Induced by High Voltage Electrostatic Field.

Authors :
He Qian
Zhan Tianyi
Zhang Haiyang
Ju Zehui
Hong Lu
Brosse Nicolas
Lu Xiaoning
Source :
MATEC Web of Conferences, Vol 275, p 01013 (2019)
Publication Year :
2019
Publisher :
EDP Sciences, 2019.

Abstract

High voltage electrostatic field (HVEF) was applied in order to improve wood surface characteristics, bonding and mechanical properties of wood composites. Masson pine (Pinus massoniana Lamp.) plywood and laminated veneer lumber (LVL) were selected in this study. Surface characteristics were conducted by the electron spin resonance (ESR) and X-ray photoelectron spectra (XPS). Bonding interphase and mechanical properties were investigated by fluorescence microscopy and vertical density profile (VDP), bonding strength, wood failure ratio, MOE and MOR. The results indicated that more increments were obtained in free radicals, O/C ratios and C2-C4 components. This is because electrons broke more wood chemical groups and new ions occurred among wood surface under HVEF. Significantly decreased PF adhesive penetration depth (PD) and increased density at bonding interphase was achieved in HVEF treated composites. More decrease of PD and increment of density were observed in plywood than that of LVL. This was attributed to cross linked wood fibers among bonding interphase in plywood. Mechanical properties of bonding strength, wood failure ratio, MOE and MOR were significantly increased under HVEF treatment both for two composites. Higher bonding strength, MOE and MOR were obtained in plywood and their increments were as 98.53%, 33.33%, 18.55% and 12.72%.

Details

Language :
English, French
ISSN :
2261236X
Volume :
275
Database :
Directory of Open Access Journals
Journal :
MATEC Web of Conferences
Publication Type :
Academic Journal
Accession number :
edsdoj.10947b74b6386aeec302ac9e287
Document Type :
article
Full Text :
https://doi.org/10.1051/matecconf/201927501013