Experimental and MD simulation study of surface residual stress and surface quality of SiCp/Al in pulsed laser-ultrasonic assisted grinding

MLA

Jieqiong Lin, et al. “Experimental and MD Simulation Study of Surface Residual Stress and Surface Quality of SiCp/Al in Pulsed Laser-Ultrasonic Assisted Grinding.” Journal of Materials Research and Technology, vol. 30, no. 7741–7755, May 2024, pp. 7741–55. EBSCOhost, https://doi.org/10.1016/j.jmrt.2024.05.171.

APA

Jieqiong Lin, Bin Fu, Yan Gu, Yuan Xi, Licheng Fu, Shuang Wu, Mingshuo Kang, & Guangyu Liang. (2024). Experimental and MD simulation study of surface residual stress and surface quality of SiCp/Al in pulsed laser-ultrasonic assisted grinding. Journal of Materials Research and Technology, 30(7741–7755), 7741–7755. https://doi.org/10.1016/j.jmrt.2024.05.171

Chicago

Jieqiong Lin, Bin Fu, Yan Gu, Yuan Xi, Licheng Fu, Shuang Wu, Mingshuo Kang, and Guangyu Liang. 2024. “Experimental and MD Simulation Study of Surface Residual Stress and Surface Quality of SiCp/Al in Pulsed Laser-Ultrasonic Assisted Grinding.” Journal of Materials Research and Technology 30 (7741–7755): 7741–55. doi:10.1016/j.jmrt.2024.05.171.