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Enhancement of Selectivity for Chemical Mechanical Polishing by Ultra-High-Dose C and Si Ion Implantation
- Source :
- IEEE Journal of the Electron Devices Society, Vol 12, Pp 407-414 (2024)
- Publication Year :
- 2024
- Publisher :
- IEEE, 2024.
-
Abstract
- The selectivity of chemical mechanical polishing (CMP) is successfully enhanced due to the modification of the film surface by ultra-high-dose ion implantation for the first time. The removal rate (RR) of CMP for SiO2 and Si3N4 films was changed by implanted ions. On the other hand, polycrystalline silicon (poly-Si) films had no change regardless of ion implantation. When C+ is implanted at $3\times 10{^{{16}}}$ ions/cm2 into SiO2, the RR decreases by about 40% compared with that without implantation. However, no significant change was observed after the implantation of C+ at $1\times 10{^{{16}}}$ ions/cm2 or Si+ to SiO2 and poly-Si films. New findings about CMP mechanism that are against Borst’s Langmuir-Hinshelwood model have been made when the film is modified by using high-dose implantation.
Details
- Language :
- English
- ISSN :
- 21686734
- Volume :
- 12
- Database :
- Directory of Open Access Journals
- Journal :
- IEEE Journal of the Electron Devices Society
- Publication Type :
- Academic Journal
- Accession number :
- edsdoj.043900cd6b494cb48885ae955bcb4121
- Document Type :
- article
- Full Text :
- https://doi.org/10.1109/JEDS.2024.3371455