Obtaining Symmetrical Gradient Structure in Copper Wire by Combined Processing

Traditionally, structural wire is characterized by a homogeneous microstructure, where the average grain size in different parts of the wire is uniform. According to the classical Hall–Petch relationship, a homogeneous polycrystalline metal can be strengthened by decreasing the average grain size since an increase in the volume fraction of grain boundaries will further impede the motion of dislocations. However, a decrease in the grain size inevitably leads to a decrease in the ductility and deformability of the material due to limited dislocation mobility. Putting a gradient microstructure into the wire has promising potential for overcoming the compromise between strength and ductility. This is proposed a new combined technology in this paper in order to obtain a gradient microstructure. This technology consists of deforming the wire in a rotating equal-channel step die and subsequent traditional drawing. Deformation of copper wire with a diameter of 6.5 mm to a diameter of 5.0 mm was carried out in three passes at room temperature. As a result of such processing, a gradient microstructure with a surface nanostructured layer (grain size ~400 nm) with a gradual increase in grain size towards the center of the wire was obtained. As a result, the microhardness in the surface zone was 1150 MPa, 770 Mpa in the neutral zone, and 685 MPa in the central zone of the wire. Such a symmetrical spread of microhardness, observed over the entire cross-section of the rod, is a direct confirmation of the presence of a gradient microstructure in deformed materials. The strength characteristics of the wire were doubled: the tensile strength increased from 335 MPa to 675 MPa, and the yield strength from 230 MPa to 445 MPa. At the same time, the relative elongation decreased from 20% to 16%, and the relative contraction from 28% to 23%. Despite the fact that the ductility of copper is decreased after cyclic deformation, its values remain at a fairly high level. The validity of all results is confirmed by numerous experiments using a complex of traditional and modern research methods, which include optical, scanning, and transmission microscopy; determination of mechanical properties under tension; and measurement of hardness and electrical resistance. These methods allow reliable interpretation of the fine microstructure of the wire and provide information on its strength, plastic, and electrical properties.