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Photonic integrated circuit with multiple waveguide layers for broadband high-efficient on-chip 3-D optical phased arrays in light detection and ranging applications
- Publication Year :
- 2022
-
Abstract
- Traditional photonic integrated circuit (PIC) inherits the mature CMOS fabrication process from the electronic integrated circuit (IC) industry. However, this process also limits the PIC structure to a single-waveguide-layer configuration. In this work, we explore the possibility of the multi-waveguide-layer PIC by proposing and demonstrating a true 3-D optical phased array (OPA) device, with the light exiting from the edge of the device, based on a multi-layer Si3N4/SiO2 platform. The multi-waveguide-layer configuration offers the possibility of utilizing edge couplers at both the input and the emitting ends to achieve broadband high efficiency. This uniqueness provides the potential for a more extended detection range in the Lidar application. The device has been studied by numerical simulation, and proof-of-concept samples have been fabricated and tested with a CMOS-compatible process. To the best of our knowledge, this is the first experimental proof-of-concept of a true 3-D OPA with a multi-waveguide-layer configuration all over the device.
- Subjects :
- Physics - Optics
Physics - Applied Physics
Subjects
Details
- Database :
- arXiv
- Publication Type :
- Report
- Accession number :
- edsarx.2208.09783
- Document Type :
- Working Paper