Topology for Substrate Routing in Semiconductor Package Design

MLA

Seong, Rak-Kyeong, et al. Topology for Substrate Routing in Semiconductor Package Design. 2021. EBSCOhost, https://doi.org/10.1016/j.cad.2022.103269.

APA

Seong, R.-K., Yang, J., & Han, S.-H. (2021). Topology for Substrate Routing in Semiconductor Package Design. https://doi.org/10.1016/j.cad.2022.103269

Chicago

Seong, Rak-Kyeong, Jaeho Yang, and Sang-Hoon Han. 2021. “Topology for Substrate Routing in Semiconductor Package Design.” doi:10.1016/j.cad.2022.103269.