Cite
Exploring the Correlation between Solvent Diffusion and Creep Resistance of Mg-Ga HCP Alloys from High Throughput Liquid-Solid Diffusion Couple
MLA
Wang, Jingya, et al. Exploring the Correlation between Solvent Diffusion and Creep Resistance of Mg-Ga HCP Alloys from High Throughput Liquid-Solid Diffusion Couple. 2021. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsarx&AN=edsarx.2105.05096&authtype=sso&custid=ns315887.
APA
Wang, J., Xu, G., Zeng, X., Llorca, J., & Cui, Y. (2021). Exploring the Correlation between Solvent Diffusion and Creep Resistance of Mg-Ga HCP Alloys from High Throughput Liquid-Solid Diffusion Couple.
Chicago
Wang, Jingya, Guanglong Xu, Xiaoqin Zeng, Javier Llorca, and Yuwen Cui. 2021. “Exploring the Correlation between Solvent Diffusion and Creep Resistance of Mg-Ga HCP Alloys from High Throughput Liquid-Solid Diffusion Couple.” http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsarx&AN=edsarx.2105.05096&authtype=sso&custid=ns315887.