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High Performance Heat Conductor with Small Spring Constant for Cryogenic Applications

Authors :
Yamada, Tomohiro
Tomaru, Takayuki
Suzuki, Toshikazu
Ushiba, Takafumi
Kimura, Nobuhiro
Takada, Suguru
Inoue, Yuki
Kajita, Takaaki
Publication Year :
2020

Abstract

We developed a soft and high thermal conductive heat link for cryogenic applications. The measured maximum thermal conductivity was approximately 18500 W/m/K at 10 K. This spring constant was 1/43 of that of a single thick wire with the same cross-sectional area at room temperature. We realized these performances by utilizing high purity aluminum (99.9999 %, 6N) and by stranding many thin wires that are 0.15 mm in diameter. The electrical Residual Resistivity Ratio (RRR) was also measured and used to estimate the thermal conductivity by Wiedemann-Franz law. We observed the size effect on the electrical conductivity, and evaluated the effect of mechanical deformation to the RRR. These evaluations allow us to design a pragmatic heat link for cryogenic application.<br />Comment: 13 pages, 6 figures

Details

Database :
arXiv
Publication Type :
Report
Accession number :
edsarx.2003.13457
Document Type :
Working Paper
Full Text :
https://doi.org/10.1016/j.cryogenics.2021.103280