3-D Self-Assembled Soi Mems: An Example of Multiphysics Simulation

Authors :: Mendez, C.
Louis, C.
Paquay, S.
De Vincenzo, P.
Klapka, I.
Rochus, V.
Iker, F.
André, Nicolas
Raskin, J. -P.
Source :: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)
Publication Year :: 2007
Abstract: MEMS devices are typical systems where multiphysics simulations are unavoidable. In this work, we present possible applications of 3-D self-assembled SOI (Silicon-on-Insulator) MEMS such as, for instance, thermal actuators and flow sensors. The numerical simulations of these microsystems are presented. Structural and thermal parts have to be strongly coupled for correctly describing the fabrication process and for simulating the behavior of these 3-D SOI MEMS.<br />Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

Database :: arXiv
Journal :: Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)
Publication Type :: Report
Accession number :: edsarx.0711.3277
Document Type :: Working Paper

Tools