A new packaging approach for transceiver modules: Embedding the bare dies into PCB

Authors :: Li, T.
Dorren, H.J.S.
Raz, O.
Garcia Blanco, S.M.
Boller, K.J.
Sefunc, M.A.
Geuzebroek, D.
Electro-Optical Communication
Low Latency Interconnect Networks
Source :: Proceedings of the 19th Annual Symposium of the IEEE Photonics Benelux Chapter, 3-4 November 2014, Enschede, The Netherlands, 43-46, STARTPAGE=43;ENDPAGE=46;TITLE=Proceedings of the 19th Annual Symposium of the IEEE Photonics Benelux Chapter, 3-4 November 2014, Enschede, The Netherlands
Publication Year :: 2014
Publisher :: Twente University, 2014.

Language :: English
Database :: OpenAIRE
Journal :: Proceedings of the 19th Annual Symposium of the IEEE Photonics Benelux Chapter, 3-4 November 2014, Enschede, The Netherlands, 43-46, STARTPAGE=43;ENDPAGE=46;TITLE=Proceedings of the 19th Annual Symposium of the IEEE Photonics Benelux Chapter, 3-4 November 2014, Enschede, The Netherlands
Accession number :: edsair.narcis........6469486af3d9019cae9eae3ae811279a

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