Fabrication and characterization of etched facets in InP for advanced packaging of Photonic Integrated circuits

Authors :: Lemos Alvares Dos Santos, R.M.
D'Agostino, D.
Rabbani Haghighi, H.
Smit, M.K.
Leijtens, X.J.M.
Garcia Blanco, S.M.
Boller, K.J.
Sefunc, M.A.
Geuzebroek, D.
Photonic Integration
Source :: Proceedings of the 19th Annual Symposium of the IEEE Photonics Benelux Chapter, 2-4 November 2014, Enschede, The Netherlands, 107-110, STARTPAGE=107;ENDPAGE=110;TITLE=Proceedings of the 19th Annual Symposium of the IEEE Photonics Benelux Chapter, 2-4 November 2014, Enschede, The Netherlands
Publication Year :: 2014
Publisher :: Twente University, 2014.
Abstract: In this work we describe the fabrication and characterization of straight and angled etched facets compatible with the standard COBRA active-passive process. The implementation of these structures enables advanced packaging of photonic integrated circuits with multiple optical inputs and outputs.

Subjects :: Physics::Instrumentation and Detectors
Hardware_INTEGRATEDCIRCUITS
Physics::Optics
Computer Science::Other

Language :: English
Database :: OpenAIRE
Journal :: Proceedings of the 19th Annual Symposium of the IEEE Photonics Benelux Chapter, 2-4 November 2014, Enschede, The Netherlands, 107-110, STARTPAGE=107;ENDPAGE=110;TITLE=Proceedings of the 19th Annual Symposium of the IEEE Photonics Benelux Chapter, 2-4 November 2014, Enschede, The Netherlands
Accession number :: edsair.narcis........4ded6466b2816578cb34c6f1dd5b9406

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