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Detection and Characterization Method for Interface Bonding Defects of New Composite Materials
- Source :
- IEEE Access, Vol 7, Pp 134330-134337 (2019)
- Publication Year :
- 2019
- Publisher :
- Institute of Electrical and Electronics Engineers (IEEE), 2019.
-
Abstract
- The defects such as voids and debonding within the bonding interface between the composite and the substrate are the key factors affecting the safe use of materials. In this study, Industrial Computed Tomography (ICT) was used to perform non-destructive tests of bonding defects. High-precision characterization methods are required to quantify the defects. This paper proposes an improved image segmentation processing method for accurate extraction of defect edges and quantitative characterization. With the proposed method combining mathematical morphology and Fuzzy C-Means (FCM) threshold segmentation, the irregular defects of voids and debonding can be visualized and established with corresponding quantitative indicators. The experimental results show that the defect area error of the tested bonding layer is within ±6%, which satisfies the requirements of accurate detection and characterization of interface bonding layer defects of composite components. This work provides a strong technical basis for the reliability assessment of new ceramic matrix composites (CMCs) bonded structural members.
- Subjects :
- 0209 industrial biotechnology
Materials science
General Computer Science
segmentation method
Interface (computing)
Composite number
industrial computed tomography (ICT)
General Engineering
Industrial computed tomography
02 engineering and technology
Image segmentation
Mathematical morphology
Ceramic matrix composite
Interface bonding defects
Characterization (materials science)
020303 mechanical engineering & transports
020901 industrial engineering & automation
0203 mechanical engineering
detection and characterization
General Materials Science
Segmentation
lcsh:Electrical engineering. Electronics. Nuclear engineering
Composite material
lcsh:TK1-9971
voids and debonding
Subjects
Details
- ISSN :
- 21693536
- Volume :
- 7
- Database :
- OpenAIRE
- Journal :
- IEEE Access
- Accession number :
- edsair.doi.dedup.....fedeb2d179afa356bbd9c0fba856904d