Effect of RF magnetron sputtering parameters on the optimization of the discharge capacity of ternary lithium oxide thin films

The increasing demand for lithium-ion batteries has stimulated the investigation of new compounds in order to reduce the costs and the toxicity of their cathodes. Materials constituted of ternary lithiated oxide compounds are a successful alternative to cobalt-rich cathodes. The main disadvantage of ternary compound materials (TCM) is that the maximum amount of electrical charge is only achieved at high redox potentials, a limiting factor if we consider the current development in electrolyte technology. In this work, we investigated the influence of sputtering deposition parameters on the charge capacity of TCM thin films, restraining their electrochemical potential to conventional values. To do so, we analyzed the impact that small changes in crystalline and morphological structures have on the charge capacity at low cell potentials. For this, we performed the RF magnetron sputtering of TCM thin films, and carried out a factorial design of experiments to investigate their electrochemical properties, while limiting the charging potential to 4.20 V vs. Li|Li+. The films were deposited onto a rigid and conductive substrate with different parameters (power and pressure at room temperature). Electrochemical results showed that the discharge capacity is strongly influenced by the deposition parameters, reaching 250 mAh g− 1 even at 4.20 V vs. Li. This value is superior to the ones of the conventional cobalt cathode and the bulk ternary electrode. Both deposition parameters exhibited a synergic dependency, which means that they need to be simultaneously varied for a response optimization. The discharge capacity of the analyzed samples was highly affected by the surface morphology of the film and its crystallographic properties, and not by its elemental composition. High discharge capacity was obtained without additional thermal treatments, which favors the manufacture of films over polymeric substrates for future electronic applications.