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Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling
- Source :
- ICICDT
- Publication Year :
- 2018
- Publisher :
- IEEE, 2018.
-
Abstract
- In this paper, we review the current progress on 3D sequential device stacking, highlighting the main integration challenges and the possible technological solutions. Next, we explore the potential benefits of 3D sequential stacking at transistor level, CMOS level and for hybrid circuits.
- Subjects :
- Computer science
Stacking
wafer bonding
Silicon on insulator
02 engineering and technology
law.invention
law
Hardware_INTEGRATEDCIRCUITS
0202 electrical engineering, electronic engineering, information engineering
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Scaling
Electronic circuit
business.industry
020208 electrical & electronic engineering
Transistor
020206 networking & telecommunications
silicon-on-insulator
Semiconductor
CMOS
Hardware and Architecture
Logic gate
Systems engineering
thermal budget
junctionless
business
3D sequential
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- 2018 International Conference on IC Design & Technology (ICICDT)
- Accession number :
- edsair.doi.dedup.....fb38526227121e8b2c17205e8aff47dc
- Full Text :
- https://doi.org/10.1109/icicdt.2018.8399777