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In situ evaluation of the low-temperature aging response of Ti–5Al–5Mo–5V–3Cr alloy as influenced by starting microstructure
- Source :
- Repositório Institucional da USP (Biblioteca Digital da Produção Intelectual), Universidade de São Paulo (USP), instacron:USP
- Publication Year :
- 2020
-
Abstract
- The impact of starting microstructure on the isothermal behavior of β-metastable Ti–5Al–5Mo–5V–3Cr alloy during aging at 400 °C for 8 h was studied by means of in situ synchrotron X-ray diffraction. Results show that prior deformation does not accelerate phase precipitation during heating, but has an influence on secondary α precipitation during aging, and that the composition of the β matrix, which is affected by the amount of primary α formed depending on the preliminary processing route applied, plays a major role. At this aging temperature, α" phase tends to form from the β matrix in high quantities without the presence of primary α phase or with a low fraction of this phase, and the conversion of α" into α is sluggish, being faster in the β-heat-treated condition, whereas a continuous β → α transformation occurs, with no reliable evidence of α" precipitation, in the α+β-heat-treated condition. Isothermal precipitation was enough to promote a significant hardness increase in the alloy. Observation of the behavior of α" based on its atomic y-coordinate and orthorhombicity helped to elucidate its transformation pathway.
- Subjects :
- In situ
Materials science
MATERIAIS
Precipitation (chemistry)
Mechanical Engineering
Alloy
Metals and Alloys
02 engineering and technology
engineering.material
010402 general chemistry
021001 nanoscience & nanotechnology
Microstructure
01 natural sciences
Synchrotron
Isothermal process
0104 chemical sciences
law.invention
Chemical engineering
Mechanics of Materials
law
Phase (matter)
Materials Chemistry
engineering
Deformation (engineering)
0210 nano-technology
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- Repositório Institucional da USP (Biblioteca Digital da Produção Intelectual), Universidade de São Paulo (USP), instacron:USP
- Accession number :
- edsair.doi.dedup.....f8af6e2801aba865e8085291f3ef6474