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Complex Geometry Strain Sensors Based on 3D Printed Nanocomposites: Spring, Three-Column Device and Footstep-Sensing Platform

Authors :
Claudio Sbarufatti
Silvia G. Prolongo
Mónica Campo
Xoan F. Sánchez-Romate
A. Cortés
Alejandro Ureña
A. Esmaeili
Alberto Jiménez-Suárez
Source :
Nanomaterials, Nanomaterials, Vol 11, Iss 1106, p 1106 (2021), Volume 11, Issue 5
Publication Year :
2021
Publisher :
MDPI AG, 2021.

Abstract

Electromechanical sensing devices, based on resins doped with carbon nanotubes, were developed by digital light processing (DLP) 3D printing technology in order to increase design freedom and identify new future and innovative applications. The analysis of electromechanical properties was carried out on specific sensors manufactured by DLP 3D printing technology with complex geometries: a spring, a three-column device and a footstep-sensing platform based on the three-column device. All of them show a great sensitivity of the measured electrical resistance to the applied load and high cyclic reproducibility, demonstrating their versatility and applicability to be implemented in numerous items in our daily lives or in industrial devices. Different types of carbon nanotubes—single-walled, double-walled and multi-walled CNTs (SWCNTs, DWCNTs, MWCNTs)—were used to evaluate the effect of their morphology on electrical and electromechanical performance. SWCNT- and DWCNT-doped nanocomposites presented a higher Tg compared with MWCNT-doped nanocomposites due to a lower UV light shielding effect. This phenomenon also justifies the decrease of nanocomposite Tg with the increase of CNT content in every case. The electromechanical analysis reveals that SWCNT- and DWCNT-doped nanocomposites show a higher electromechanical performance than nanocomposites doped with MWCNTs, with a slight increment of strain sensitivity in tensile conditions, but also a significant strain sensitivity gain at bending conditions.

Details

ISSN :
20794991
Volume :
11
Database :
OpenAIRE
Journal :
Nanomaterials
Accession number :
edsair.doi.dedup.....f5922c07d4785c8600dea07613f466c7