Back to Search
Start Over
Thermal measurement and numerical analysis for automotive power modules
- Source :
- 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
- Publisher :
- IEEE
-
Abstract
- The presented analysis has been aimed to evaluate the impact of die solder and sintering solution for automotive power modules in terms of thermal behavior. First, dedicated temperature measurements have been performed to evaluate the module thermal impedance in the two cases. Then, a lumped equivalent networks has been calculated, by means of a dedicated numeric, and finally function structures have been extracted
- Subjects :
- 010302 applied physics
Materials science
business.industry
Thermal resistance
020208 electrical & electronic engineering
Automotive industry
Mechanical engineering
02 engineering and technology
01 natural sciences
Temperature measurement
Die (integrated circuit)
Computer Science::Other
chemistry.chemical_compound
Reliability (semiconductor)
chemistry
Power module
0103 physical sciences
Thermal
0202 electrical engineering, electronic engineering, information engineering
Silicon carbide
business
Subjects
Details
- Language :
- English
- ISBN :
- 978-1-72816-049-8
- ISBNs :
- 9781728160498
- Database :
- OpenAIRE
- Journal :
- 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
- Accession number :
- edsair.doi.dedup.....f1efe1dbf893d638c7dfa1a837603d7a
- Full Text :
- https://doi.org/10.1109/eurosime48426.2020.9152204