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In-line Optical Amplification for Silicon Photonics Platform by Flip-Chip Bonded InP-SOAs
- Source :
- OFC, Scopus-Elsevier
- Publication Year :
- 2018
- Publisher :
- OSA, 2018.
-
Abstract
- We review the hybrid-integration of an InP semiconductor optical amplifier on a silicon photonics chip, and our in-line SOA integration using precise flip-chip bonding technology. We demonstrate the loss-less operation of a 4×4 switch with a 4ch-SOA array.
- Subjects :
- Optical amplifier
Silicon photonics
Materials science
business.industry
Hardware_PERFORMANCEANDRELIABILITY
02 engineering and technology
Chip
Line (electrical engineering)
020210 optoelectronics & photonics
Hardware_INTEGRATEDCIRCUITS
0202 electrical engineering, electronic engineering, information engineering
Field size
Optoelectronics
business
Flip chip
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- Optical Fiber Communication Conference
- Accession number :
- edsair.doi.dedup.....e9ec0f2f96b6685596a1c502af03ba13