Low-Cost Energy-Efficient On-Chip Hotspot Targeted Microjet Cooling for High- Power Electronics

MLA

Eric Beyne, et al. “Low-Cost Energy-Efficient On-Chip Hotspot Targeted Microjet Cooling for High- Power Electronics.” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, Apr. 2020, pp. 577–89. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi.dedup.....e9e5f5a408d17c0be525c2a208f51e2c&authtype=sso&custid=ns315887.

APA

Eric Beyne, Vladimir Cherman, Martine Baelmans, Herman Oprins, & Tiwei Wei. (2020). Low-Cost Energy-Efficient On-Chip Hotspot Targeted Microjet Cooling for High- Power Electronics. IEEE Transactions on Components, Packaging and Manufacturing Technology, 10, 577–589.

Chicago

Eric Beyne, Vladimir Cherman, Martine Baelmans, Herman Oprins, and Tiwei Wei. 2020. “Low-Cost Energy-Efficient On-Chip Hotspot Targeted Microjet Cooling for High- Power Electronics.” IEEE Transactions on Components, Packaging and Manufacturing Technology 10 (April): 577–89. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsair&AN=edsair.doi.dedup.....e9e5f5a408d17c0be525c2a208f51e2c&authtype=sso&custid=ns315887.