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Low-Cost Energy-Efficient On-Chip Hotspot Targeted Microjet Cooling for High- Power Electronics
- Source :
- IEEE Transactions on Components, Packaging and Manufacturing Technology. 10:577-589
- Publication Year :
- 2020
- Publisher :
- Institute of Electrical and Electronics Engineers (IEEE), 2020.
-
Abstract
- This article presents the design, fabrication, experimental characterization, and modeling analysis of the chip-level hotspot targeted liquid impingement jet cooling for high-power electronics. The hotspot targeted jet impingement cooling concept is successfully demonstrated with a chip-level jet impingement cooler with a 1-mm nozzle pitch and 300- $\mu \text{m}$ nozzle diameter fabricated using high-resolution stereolithography (additive manufacturing). The computational fluid dynamics (CFD) modeling and experimental analysis show that the improved hotspot targeted cooler design with fully open outlets can reduce the on-chip temperature difference by 70% compared with the full array cooler at the same pumping power of 0.03 W. The local heat transfer coefficient can achieve $15\times 10^{4}$ W/m2 K with a local flow rate per nozzle of 40 mL/min, requiring a pump power of 0.6 W. The benchmarking study proves that the hotspot targeted cooling is much more energy-efficient than uniform array cooling, with lower temperature difference and lower pump power.
- Subjects :
- Technology
Fabrication
Materials science
020209 energy
Nuclear engineering
Materials Science
Nozzle
Materials Science, Multidisciplinary
02 engineering and technology
Heat transfer coefficient
Computational fluid dynamics
Industrial and Manufacturing Engineering
law.invention
Engineering
law
HEAT-TRANSFER
Hotspot (geology)
0202 electrical engineering, electronic engineering, information engineering
Electronics
temperature uniformity
Electrical and Electronic Engineering
Stereolithography
Science & Technology
business.industry
energy-efficient
Engineering, Electrical & Electronic
021001 nanoscience & nanotechnology
Electronic, Optical and Magnetic Materials
Volumetric flow rate
Engineering, Manufacturing
targeted cooling
THERMAL MANAGEMENT
Computational fluid dynamics (CFD)
hotspot
0210 nano-technology
business
Subjects
Details
- ISSN :
- 21563985 and 21563950
- Volume :
- 10
- Database :
- OpenAIRE
- Journal :
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- Accession number :
- edsair.doi.dedup.....e9e5f5a408d17c0be525c2a208f51e2c