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Antioxidant Therapy and Antioxidant-Related Bionanomaterials in Diabetic Wound Healing
- Source :
- Frontiers in Bioengineering and Biotechnology, Frontiers in Bioengineering and Biotechnology, Vol 9 (2021)
- Publication Year :
- 2021
-
Abstract
- Ulcers are a lower-extremity complication of diabetes with high recurrence rates. Oxidative stress has been identified as a key factor in impaired diabetic wound healing. Hyperglycemia induces an accumulation of intracellular reactive oxygen species (ROS) and advanced glycation end products, activation of intracellular metabolic pathways, such as the polyol pathway, and PKC signaling leading to suppression of antioxidant enzymes and compounds. Excessive and uncontrolled oxidative stress impairs the function of cells involved in the wound healing process, resulting in chronic non-healing wounds. Given the central role of oxidative stress in the pathology of diabetic ulcers, we performed a comprehensive review on the mechanism of oxidative stress in diabetic wound healing, focusing on the progress of antioxidant therapeutics. We summarize the antioxidant therapies proposed in the past 5 years for use in diabetic wound healing, including Nrf2- and NFκB-pathway-related antioxidant therapy, vitamins, enzymes, hormones, medicinal plants, and biological materials.
- Subjects :
- 0301 basic medicine
Histology
Antioxidant
medicine.medical_treatment
Biomedical Engineering
030209 endocrinology & metabolism
Bioengineering
wound healing
Review
Pharmacology
medicine.disease_cause
03 medical and health sciences
bionanomaterials
0302 clinical medicine
Polyol pathway
Glycation
Diabetes mellitus
Medicine
oxidative stress
Protein kinase C
business.industry
antioxidative therapy
Bioengineering and Biotechnology
medicine.disease
030104 developmental biology
diabetes mellitus
business
Wound healing
TP248.13-248.65
Oxidative stress
Biotechnology
Hormone
Subjects
Details
- ISSN :
- 22964185
- Volume :
- 9
- Database :
- OpenAIRE
- Journal :
- Frontiers in bioengineering and biotechnology
- Accession number :
- edsair.doi.dedup.....e7ce1ebdabe529c5f4c240d62ea816e5