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On the Co-simulation of SystemC with QEMU and OVP Virtual Platforms

Authors :
Alessandro Lonardi
Graziano Pravadelli
University of Verona (UNIVR)
EDALab s.r.l. [Verona]
Luc Claesen
Maria-Teresa Sanz-Pascual
Ricardo Reis
Arturo Sarmiento-Reyes
TC 10
WG 10.5
Source :
IFIP Advances in Information and Communication Technology, 22th IFIP/IEEE International Conference on Very Large Scale Integration-System on a Chip (VLSI-SoC 2014), 22th IFIP/IEEE International Conference on Very Large Scale Integration-System on a Chip (VLSI-SoC 2014), Oct 2014, Playa del Carmen, Mexico. pp.110-128, ⟨10.1007/978-3-319-25279-7_7⟩, VLSI-SoC: Internet of Things Foundations ISBN: 9783319252780, VLSI-SoC (Selected Papers)
Publication Year :
2014
Publisher :
HAL CCSD, 2014.

Abstract

International audience; Virtual prototyping allows designers to set up an electronic system level software simulator of a full HW/SW platform to carry out SW development and HW design almost in parallel. To achieve the goal virtual prototyping tools allow the co-simulation between an efficient instruction set simulator, mainly based on dynamic binary translation of the target code, and simulation kernels for HW models, described by means of traditional hardware description languages, like, for example, SystemC. In this context, some approaches have been proposed for co-simulation between QEMU and SystemC, both from EDA companies and academic research groups. On the contrary, no paper addresses integration between Open Virtual Platform (OVP) and SystemC. Indeed, OVP models and the related simulator can be integrated into SystemC designs by using TLM 2.0 wrappers and opportune OVP APIs. However, this solution presents some disadvantages, like the incapability of supporting cycle-accurate models, and the necessity of re-design, in terms of SystemC modules, all OVP components that should be integrated in the target platform. To avoid such drawbacks, and provide an easy way to port SystemC models from a QEMU-based to an OVP-based virtual platform and vice versa, this paper presents a common co-simulation approach that works for integrating SystemC components with both QEMU and OVP. Experimental results show the effectiveness of the proposed architecture.

Details

Language :
English
ISBN :
978-3-319-25278-0
ISBNs :
9783319252780
Database :
OpenAIRE
Journal :
IFIP Advances in Information and Communication Technology, 22th IFIP/IEEE International Conference on Very Large Scale Integration-System on a Chip (VLSI-SoC 2014), 22th IFIP/IEEE International Conference on Very Large Scale Integration-System on a Chip (VLSI-SoC 2014), Oct 2014, Playa del Carmen, Mexico. pp.110-128, ⟨10.1007/978-3-319-25279-7_7⟩, VLSI-SoC: Internet of Things Foundations ISBN: 9783319252780, VLSI-SoC (Selected Papers)
Accession number :
edsair.doi.dedup.....e205c9c35e2f3f7f19092c81e37e130c
Full Text :
https://doi.org/10.1007/978-3-319-25279-7_7⟩