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High resolution acoustic metrology by combining high GHZ frequency ultrasound and scanning probe microscopy
- Source :
- Proceedings Metrology, Inspection, and Process Control for Microlithography XXXIV, 20 March 2020, SPIE Event on Advanced Lithography, San Jose, CA, USA, 11325, 113250C-1-113250C-7, Robinson, J.C.Adan, O., Proceedings of SPIE-The International Society for Optical Engineering, Metrology, Inspection, and Process Control for Microlithography XXXIV 2020, 24 February 2020 through 27 February 2020
- Publication Year :
- 2020
- Publisher :
- SPIE, 2020.
-
Abstract
- In order to extract ever more performance from semiconductor devices on the same device area, the semiconductor industry is moving towards device structures with increasingly complex material combinations and 3D geometries. To ensure cost effective fabrication of next generation devices, metrology solutions are needed that tackle the specific challenges that come from these developments such as 3 dimensional imaging of structures and imaging of deeply buried structures under arbitrary, complex layers. Compared to existing metrology solutions for high end manufacturing, ultrasonic inspection techniques have advantages: they are unaffected by optically opaque layers, the acoustic wavelength (60nm @ 100GHz in SiO2) can be smaller than optical wavelengths and the measurement depth can be larger. However, traditional acoustic microscopy tops out at a few GHz due to manufacturing tolerances and the required liquid couplant. We propose to combine very high frequency ultrasound with scanning probe microscopy. By locating the transducer above the cantilever tip, it guides sound into the sample with a dry tip-sample contact. This allows for very high acoustic frequencies and a resolution of O(wavelength). © 2020 SPIE.
- Subjects :
- Materials science
Cost effectiveness
Hydrophobicity
Acoustic microscopy
High Tech Systems & Materials
Scanning probe microscopy
Optics
Semiconductor devices
Very high frequency
High resolution
Semiconductor industry
Ultrasonic testing
Fits and tolerances
Industrial Innovation
business.industry
Inspection
Semiconductor device manufacture
Acoustic wavelength
Buried structures
Silica
Cost-effective fabrication
Semiconductor device
Acoustic metrologies
Ultrasonic inspections
Semiconductor device structures
Metrology
Manufacturing tolerances
Wavelength
Transducer
Acoustic variables measurement
Process control
business
Subjects
Details
- Database :
- OpenAIRE
- Journal :
- Metrology, Inspection, and Process Control for Microlithography XXXIV
- Accession number :
- edsair.doi.dedup.....df07717fccee99dfde1d66c524583502