Residual layer-free reverse nanoimprint lithography on silicon and metal-coated substrates

In this work we demonstrate that Reverse Nanoimprint Lithography is a feasible and flexible lithography technique applicable to the transfer of micro and nano polymer structures with no residual layer over areas of cm2 areas on silicon, metal and non-planar substrates. We used a flexible polydimethylsiloxane stamp with hydrophobic features. We present residual layer-free patterns imprinted using a commercial poly(methylmethacrylate) thermoplastic polymer over silicon, nickel and pre-patterned substrates. Our versatile patterning technology is adaptable to free form nano structuring and has coupling to adhesion technologies.
The support of the project PLAST-4-FUTURE funded by the European Commission (FP7-2012-NMP-ICT-FoF) under Grant Agreement number 314345 (www.plast4future.eu) and of the national project MAT-2012-31392 TAPHOR are gratefully acknowledged.