Advances in in situ nanomechanical testing

In situ nanomechanical testing provides critical insight into the fundamental processes that lead to deformation phenomena in materials. Often, in situ tests are performed in relevant conditions such as high or low temperatures, tribological contact, gas environments, or under radiation exposure. Modern diffraction and imaging methods of materials under load provide high spatial resolution and enable extraction of quantitative mechanical data from local microstructure components or nano-sized objects. The articles in this issue cover recent advances in different types of in situ nanomechanical testing methods, spanning from dedicated nanomechanical testing platforms and microelectromechanical systems devices to deformation analyses via in situ diffraction and imaging methods. This includes scanning electron microscopy, advanced scanning transmission electron microscopy, electron diffraction, x-ray diffraction, and synchrotron techniques. Emerging areas such as in situ tribology enable novel insights into the origin of deformation mechanisms, while the evolution of microelectromechanical systems for controlled in situ testing provide opportunities for advanced control and loading strategies. Discussion on the current state of the art for in situ nanomechanical testing and future opportunities in imaging, strain sensing, and testing environments are also addressed.