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An automated testing system for the RD51 VMM hybrid and yield measurement of the first production batches

Authors :
Finn Jaekel
Klaus Desch
Jochen Kaminski
Michael Lupberger
Lucian Scharenberg
Patrick Schwaebig
Source :
arXiv pre-print for a publication submitted to NIM A, in review
Publication Year :
2022

Abstract

We present the development of an automated testing system for the VMM hybrid of the RD51 collaboration. The VMM hybrid is a new front-end board for the RD51 common readout system, the Scalable Readout System, and will become the workhorse for the next decade to read out Micro-Pattern Gaseous Detectors. It uses the VMM chip developed for the ATLAS New Small Wheel to convert charge signals from detectors to digital data. Our testing system automatically characterises the quality of the VMM chips on the hybrid after production during multiple tests. Results are evaluated to classify the chips and hybrids and uploaded to a database. We evaluated those results for the first two production batches to measure the production yield. The yield is better than the threshold below which chip testing on a wafer level offers financial benefits. Observations on prominent chip failures were propagated back to the hybrid production process to further increase the yield for future productions. We present the development of an automated testing system for the VMM hybrid of the RD51 collaboration. The VMM hybrid is a new front-end board for the RD51 common readout system, the Scalable Readout System, and will become the workhorse for the next decade to read out Micro-Pattern Gaseous Detectors. It uses the VMM chip developed for the ATLAS New Small Wheel to convert charge signals from detectors to digital data. Our testing system automatically characterises the quality of the VMM chips on the hybrid after production during multiple tests. Results are evaluated to classify the chips and hybrids and uploaded to a database. We evaluated those results for the first two production batches to measure the production yield. The yield is better than the threshold below which chip testing on a wafer level offers financial benefits. Observations on prominent chip failures were propagated back to the hybrid production process to further increase the yield for future productions.

Details

ISSN :
01689002
Database :
OpenAIRE
Journal :
arXiv pre-print for a publication submitted to NIM A, in review
Accession number :
edsair.doi.dedup.....b54688da70c0badbb94a22b96584e358
Full Text :
https://doi.org/10.48550/arxiv.2206.00033