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Materials and Defect Aspects of III-V and III-N Devices for High-Speed Analog/RF Applications
- Source :
- 2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT).
- Publication Year :
- 2020
- Publisher :
- IEEE, 2020.
-
Abstract
- This paper describes the application of Deep Level Transient Spectroscopy and Generation-Recombination Noise Spectroscopy to the study of trap levels in III-V and III-N materials and devices.
Details
- Database :
- OpenAIRE
- Journal :
- 2020 IEEE 15th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)
- Accession number :
- edsair.doi.dedup.....b48d48fd0653aed31b43fd47df41f3b2
- Full Text :
- https://doi.org/10.1109/icsict49897.2020.9278262