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Low cost camera modules using integration of wafer-scale optics and wafer-level packaging of image sensors
- Source :
- SPIE Proceedings.
- Publication Year :
- 2009
- Publisher :
- SPIE, 2009.
-
Abstract
- Using wafer scale optics, wafer scale integration, and wafer level packaging of image sensor, we developed small form factor (3.3mm×3.3mm×2.4mm), low manufacturing cost, Pb-free solder reflow compatible digital camera modules which are suitable for many applications including mobile electronic devices, automotives, security, and medical applications.
- Subjects :
- Materials science
Wafer-scale integration
business.product_category
business.industry
Computer science
Wafer bonding
ComputerApplications_COMPUTERSINOTHERSYSTEMS
Wafer backgrinding
Manufacturing cost
Embedded Wafer Level Ball Grid Array
Optics
Chip-scale package
Wafer dicing
Wafer
Image sensor
business
Wafer-level packaging
Digital camera
Subjects
Details
- ISSN :
- 0277786X
- Database :
- OpenAIRE
- Journal :
- SPIE Proceedings
- Accession number :
- edsair.doi.dedup.....ad79099459177b076c9617031257131e